ProfessorFalken
Registered user
Registered: 12-2017
|
Reply | Quote
|
|
Finally a 3d stacked chip is coming to market
https://www.wired.com/story/intel-foveros-chips-breakthrough/amp?__twitter_impression=true
Let me know when the stack is 100 layers thick.
Last edited by ProfessorFalken, 12/13/2018, 2:20 am
|
12/13/2018, 2:19 am
|
Link to this post
PM ProfessorFalken
Blog
|
greendocnowciv
Registered: 11-2017
|
Reply | Quote
|
|
Re: Finally a 3d stacked chip is coming to market
Yes, more complex architecture would be cool.
Atomic level manufacture is of course desired. An EV post from Court:
http://bescapevelocity.runboard.com/t4861
...shows us that we can anticipate 1000 times smaller items being made, at first of course in very limited applications.
But its hard to see how chip architecture wont be high on the list of application priorities.
Still, thanks for the article here about the 3-stack from Intel. It shows they have come up with a winner, if it is true.
As the tech-Buddha said:
Every 100 layer chip starts with the second, then third layers..
Last edited by greendocnowciv, 12/14/2018, 10:34 am
|
12/14/2018, 10:33 am
|
Link to this post
PM greendocnowciv
Blog
|